10CL010ZM164I8G vs 10CL010YM164I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10CL010ZM164I8G sa pamamagitan ng Intel at 10CL010YM164I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10CL010ZM164I8G | 10CL010YM164I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kbits) | 423,936 bits (414 Kb) |
| Embedded 18x18 Multipliers | 46 | — |
| Maximum User I/O | 101 | — |
| Packhaging | 164-ball MBGA (FineLine BGA, M164) | 164-ball MBGA (8 mm x 8 mm) |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage | 1.0 V (typical), 1.2 V I/O banks | — |
| Configuration Modes | PS, FPP, JTAG | JTAG, Active Serial (AS), Passive Serial (PS) |
| PLLs | 4 (per device, exact count [DATA_NEEDED: PLL count]) | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| External Memory Support | DDR2, DDR3, LPDDR2 (via soft IP) | — |
| Tindminan RoHS | Compliant | Compliant |
| Packaging | Tray (I8G suffix) | — |
| Embedded 18 x 18 Multipliers | — | 23 |
| Maximum User I/O Pins | — | 101 |
| General-Purpose PLLs | — | 2 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (1.2 V nominal) |
| Hanay ng Temperature na Operasyon | — | -40 °C to 100 °C (Industrial) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| I/O Signaling Standards | — | LVCMOS 1.2 V to 3.3 V, LVDS |
| Process Node | — | TSMC low-power process |
| Level ng MSL | — | 3 (per JEDEC J-STD-020, typical for BGA) |