10M02DCU324A7G vs 10M02DCV36C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M02DCU324A7G sa pamamagitan ng Intel at 10M02DCV36C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M02DCU324A7G | 10M02DCV36C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements (LE) | 2,000 | — |
| Embedded Memory | 110,592 bits | 110,592 bits |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Temperature ng Junction na Operasyon | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | 55 nm |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Device Type | — | Non-volatile field-programmable gate array |
| Series | — | MAX 10 |
| Logic Elements | — | 2,000 |
| I/O Pins | — | 27 |
| Operating Voltage | — | 1.2 V |
| Packhaging | — | 36-WFBGA, WLCSP |
| FPGA Configuration | — | Non-volatile |
| Logic Architecture | — | Field-programmable gate array |
| Product Category | — | Embedded FPGA |
| Package Pin Count | — | 36 balls |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |