10M08DCF256I7G vs 10M16DCF256I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DCF256I7G sa pamamagitan ng Intel at 10M16DCF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DCF256I7G | 10M16DCF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 | 16,000 |
| Embedded Memory (bits) | 387,072 | — |
| User I/O Count | 178 | 178 |
| DSP Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Packhaging | 256-FBGA (FineLine BGA) | 256-ball FBGA (F256) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Supply Voltage - Core | [DATA_NEEDED: core voltage range] | — |
| Supply Voltage - I/O Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) | — |
| On-die ADC | 12-bit, up to 1 MSa/s | — |
| External Memory Interface | LPDDR2 / DDR3 / DDR3L | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Technology | 55 nm NOR-flash-backed CMOS | 55 nm |
| Product Line | — | MAX 10 |
| Embedded Memory Bits | — | 562,176 bits |
| User Flash Memory | — | 256 Kbits |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (I7: -40C to +100C) |
| Embedded Multipliers (18x18) | — | 45 |
| PLL Count | — | 4 |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| On-chip ADC | — | 12-bit, 1 MSPS, up to 18 analog inputs |
| Hard Memory Controller | — | DDR3 SDRAM |
| Configuration Method | — | Internal flash, instant-on |