10M08DCV81I7G vs 10M02DCV36C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DCV81I7G sa pamamagitan ng Altera at 10M02DCV36C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DCV81I7G | 10M02DCV36C7G |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 8000 | — |
| Embedded User Flash | 387072 bit (378 Kbit) | — |
| Maximum User I/Os | 56 | — |
| Package Type | 81-ball WLCSP (UFBGA, wafer-level chip-scale package) | — |
| Process Node | [DATA_NEEDED: process node] | — |
| Configuration Memory | On-chip dual-configuration flash, instant-on | — |
| Embedded ADC | 12-bit SAR ADC (1 Msps) [DATA_NEEDED: number of channels] | — |
| Temperature na Operasyon | Industrial -40C to +100C (I7 grade) | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| I/O Bank Count | [DATA_NEEDED: number of I/O banks] | — |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, RSDS | — |
| Memory Interfaces | DDR3, DDR3L, LPDDR2 (external PHY required) | — |
| PLL Count | [DATA_NEEDED: number of PLLs] | — |
| Global Clock Networks | [DATA_NEEDED: clock network count] | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Uri ng Pagpapasok | Surface Mount (WLCSP - requires underfill) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Design Software | Intel Quartus Prime (MAX 10 device support) | — |
| Device Type | — | Non-volatile field-programmable gate array |
| Series | — | MAX 10 |
| Logic Elements | — | 2,000 |
| I/O Pins | — | 27 |
| Embedded Memory | — | 110,592 bits |
| Operating Voltage | — | 1.2 V |
| Process Technology | — | 55 nm |
| Packhaging | — | 36-WFBGA, WLCSP |
| FPGA Configuration | — | Non-volatile |
| Logic Architecture | — | Field-programmable gate array |
| Product Category | — | Embedded FPGA |
| Package Pin Count | — | 36 balls |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |