5CGXBC7D7F31C8N vs 5CGXBC7D6F31C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC7D7F31C8N sa pamamagitan ng Intel at 5CGXBC7D6F31C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXBC7D7F31C8N | 5CGXBC7D6F31C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | Cyclone® V GX |
| Logic Elements (LE) | 149,500 | 149,500 |
| Embedded Memory (bits) | 7,880,704 | — |
| User I/O Pins | 480 | — |
| DSP Blocks (18x18) | 312 | — |
| Transceivers | 9 (up to 3.125 Gbps) | 8 channels up to 3.125 Gbps (6.144 Gbps capable) |
| PCIe Hard IP | 2 × Gen2 endpoints | — |
| PLLs | 8 | — |
| Packhaging | 896-ball FBGA, F31 (31 × 31 mm, 1.0 mm pitch) | 896-BGA (FineLine BGA, F31) |
| Process Node | TSMC 28 nm low-power | — |
| Core Voltage (VCC) | 1.1 V | — |
| Speed Grade | 8 (commercial) | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | 0°C to +85°C (Commercial) |
| Configuration Mode | Passive Serial, Fast Passive Parallel, JTAG, AES-256 encrypted | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone V GX |
| Embedded Memory | — | 7,880,704 bits |
| User I/O Count | — | 480 |
| DSP Blocks | — | 156 (18x18 multipliers) |
| Process Technology | — | 28 nm TSMC low-power |
| Core Voltage | — | 1.1 V |
| Package Outline | — | 31 mm × 31 mm |
| Ball Pitch | — | 1.0 mm |
| Hard IP | — | PCIe Gen2 ×1/×2/×4, DDR3/LPDDR2 controller |