5CGXFC5C6F27C7N vs 5CSEBA2U23C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXFC5C6F27C7N sa pamamagitan ng Intel at 5CSEBA2U23C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA2U23C6N - Cyclone V SE SoC FPGA, 25K LE, Dual ARM Cortex-A9 | Intel
5CSEBA2U23C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CGXFC5C6F27C7N | 5CSEBA2U23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | Cyclone V SE SoC FPGA |
| Logic Elements | 77,000 | 25,000 |
| Embedded Memory | 5,001,216 bits | [DATA_NEEDED: M10K / MLAB bits] |
| Number of M10K Blocks | 446 | — |
| Number of MLAB Blocks | 832 | — |
| User I/O Pins | 336 | — |
| Hard Memory Controllers | 2 | — |
| Logic Array Blocks (LABs) | 4,535 | — |
| 18x18 Multipliers | 312 | — |
| PLLs (Fractional) | 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Transceiver Channels | 6 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Temperature na Operasyon | 0C to +85C (Commercial) | -40°C to +100°C (industrial) |
| Packhaging | 672-FBGA (27 mm x 27 mm, 1.0 mm pitch) | 672-pin UBGА (UBGA) 23 × 23 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Process Technology | TSMC 28 nm low-power | 28 nm |
| Series | Cyclone V | — |
| Supplier Device Package | 672-FBGA | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 925 MHz |
| User I/O | — | 188 |
| Speed Grade | — | -6 (industrial) |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes |