5CSEBA5U19A7N vs 5CSEBA5U23A7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA5U19A7N sa pamamagitan ng Intel at 5CSEBA5U23A7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA5U19A7N - Cyclone V SE SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
5CSEBA5U19A7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA5U19A7N | 5CSEBA5U23A7N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 | 85 K |
| Process Technology | 28 nm low-power | 28 nm low-power |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 700 MHz | 925 MHz |
| Packhaging | 484-pin UBG A (19x19 mm) | 672-UBGA (23x23 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Supply Voltage (Core) | 1.1 V | — |
| Operating Temperature Grade | Automotive (AEC-Q100) -40C to +125C | Automotive / -40C to +125C (per Altera ordering code 'A') |
| I/O Count | 66 (per source listing) | — |
| Memory Interface | DDR3 controller in HPS; external memory interface in FPGA fabric | — |
| DSP Blocks | Variable-precision DSP blocks | — |
| Configuration / Boot Modes | NAND, QSPI, SD/MMC | — |
| Tindminan RoHS | Compliant (per Ampheo listing) | Compliant |
| Automotive Qualification | AEC-Q100 (Automotive grade, indicated by 'A' in part number) | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| FPGA Fabric Speed Grade | — | 7 |
| User I/O Count | — | 145 |
| Embedded Memory | — | 4,450 Kbits (approximate) |
| DSP Blocks (18x18) | — | 87 |
| PLLs | — | 6 (approximate, per device family) |
| Configuration Method | — | Serial (EPCS) or parallel flash with AES-128/256 |
| Level ng MSL | — | 3 (per JEDEC J-STD-020, typical for BGA packages) |