5CSEBA6U19I7NTS vs 5CSEBA6U19I7SN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA6U19I7NTS sa pamamagitan ng Intel at 5CSEBA6U19I7SN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA6U19I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 484-UBGA | Intel
5CSEBA6U19I7NTS ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA6U19I7NTS | 5CSEBA6U19I7SN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Type | System-on-Chip FPGA (SoC FPGA) | — |
| Series | Cyclone V SE | — |
| Logic Elements | 110K | — |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 925 MHz | 800 MHz |
| FPGA Architecture | Cyclone V SE, 28 nm low-power process | — |
| Packhaging | 484-ball UBGA (19x19 mm) | 484-pin UBGA (19x19 mm) |
| Temperature na Operasyon | -40C to +100C (Industrial, 'I7' speed grade) | Industrial grade (I) -40C to +100C junction |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM-based, via Quartus Prime | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Variable-precision DSP blocks |
| Uri ng Memory | DDR3/DDR3L with ECC support | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART | — |
| Device Family | Cyclone V | — |
| Family Variant | SE (SoC FPGA with HPS) | — |
| Family | — | Cyclone V SE SoC FPGA |
| Hard Processor System (HPS) | — | Single-core ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements (LEs) | — | 110,000 |
| Logic Array Blocks (LABs) | — | 4150 |
| Maximum User I/Os | — | 66 |
| On-chip Memory | — | 64 KB |
| PLLs | — | Integrated phase-locked loops |
| External Memory Support | — | DDR3, DDR3L, LPDDR2 (via HPS) |
| Process Technology | — | 28 nm low-power (TSMC) |
| Lead Free | — | Yes |
| Ordering Part Number | — | 5CSEBA6U19I7SN |