A3P1000-2FGG144I vs A3P600-2FGG144 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P1000-2FGG144I sa pamamagitan ng Microchip Technology at A3P600-2FGG144 sa pamamagitan ng Microsemi. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P1000-2FGG144I - ProASIC3 FPGA, 1M Gates | Microchip
A3P1000-2FGG144I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P1000-2FGG144I | A3P600-2FGG144 |
|---|---|---|
| Brand | Microchip Technology | Microsemi |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 1,000,000 | — |
| Logic Elements | 11K | — |
| User I/Os | 97 | — |
| Flash Memory | 147,456 bits | — |
| Core Voltage | 1.5 V | 1.5 V |
| System Performance | 310 MHz | 310 MHz |
| I/O Banks | 4 | 4 (independently supplied VCCIB banks) |
| Packhaging | 144-pin FBGA (FGG144) | 144-Ball FBGA (FGG144) |
| Temperature na Operasyon | -40°C to +100°C | [DATA_NEEDED: operating temperature range] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Programming Interface | JTAG | — |
| Technology | 130nm Flash | — |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| Process Technology | — | 130 nm CMOS |
| Program Technology | — | Nonvolatile Flash |
| Ball Pitch | — | 1 mm |
| Packaging | — | Tray |
| Speed Grade | — | -2 |
| Configuration | — | Single-chip, Instant On, no external boot device |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |