A3P125VQG100 vs A3P125-1VQG100T Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P125VQG100 sa pamamagitan ng Microchip Technology at A3P125-1VQG100T sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P125-VQG100 ProASIC3 Flash FPGA 71 I/O TQFP-100 | Microchip
A3P125VQG100 ✓ NakahandaMicrochip Technology
A3P125-1VQG100T - 125K Gate ProASIC3 FPGA 272MHz | Microchip
A3P125-1VQG100T ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P125VQG100 | A3P125-1VQG100T |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Elements | 1500 LEs (1.5K) | — |
| Number of I/O | 71 | — |
| Embedded Memory | 36864 bits true dual-port SRAM | — |
| Family | ProASIC3 Flash FPGA | ProASIC3 |
| Technology | Nonvolatile Flash | — |
| Packhaging | 100-TQFP (VQG100, 14x14 mm) | 100-Pin TQFP (VQFP-100) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration | Self-contained, instant-on (no external boot PROM) | — |
| Soft ARM Support | Optional (ProASIC3 family feature) | — |
| LVDS-capable I/O | Supported in ProASIC3 family (700 Mbps DDR on A3P250 and above) | — |
| Volte ng Pagbibigay | [DATA_NEEDED: core/IO supply voltage] | — |
| Maximum Operating Frequency | [DATA_NEEDED: system performance] | 272 MHz |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: temperature grade for VQG100 speed grade] | [DATA_NEEDED: operating temperature range] |
| Speed Grade | [DATA_NEEDED: speed grade suffix detail] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance statement] | [DATA_NEEDED: RoHS status] |
| Standard Package Quantity | 90 | — |
| Equivalent Gate Count | — | 125000 gates |
| Logic Elements / CLBs | — | 3072 |
| User I/O | — | 71 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Configuration Technology | — | Nonvolatile Flash |
| Package Body Size | — | 14 x 14 mm |
| Lead Pitch | — | 0.5 mm |
| Packaging | — | Tray |
| Instant-On / Single Chip | — | Yes (no external configuration device required) |