A3P600-2FGG144 vs A3P060-2FGG144 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-2FGG144 sa pamamagitan ng Microsemi at A3P060-2FGG144 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P060-2FGG144 - ProASIC3 Flash FPGA 60K Gates FBGA-144 | Microchip
A3P060-2FGG144 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-2FGG144 | A3P060-2FGG144 |
|---|---|---|
| Brand | Microsemi | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 Flash FPGA |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | 96 |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm flash |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Packhaging | 144-Ball FBGA (FGG144) | 144-ball FBGA (FGG144) |
| Ball Pitch | 1 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Speed Grade | -2 | -2 |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | [DATA_NEEDED: Embedded Memory] |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| System Gates | — | 60000 |
| Maximum System Frequency | — | 310 MHz |
| Core Supply Voltage | — | 1.5 V |
| DigiKey Listing Value | — | 18432 |
| Configuration Memory | — | On-chip flash (non-volatile) |
| Number of Logic Elements | — | [DATA_NEEDED: Number of Logic Elements] |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |