A3P600-2FGG144 vs A3P600-1FGG144I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-2FGG144 sa pamamagitan ng Microsemi at A3P600-1FGG144I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-1FGG144I - ProASIC3 FPGA, 600K Gates | Microchip
A3P600-1FGG144I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-2FGG144 | A3P600-1FGG144I |
|---|---|---|
| Brand | Microsemi | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Packhaging | 144-Ball FBGA (FGG144) | 144-LBGA (13x13 mm, 0.8 mm pitch) |
| Ball Pitch | 1 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| System Gates | — | 600000 |
| Logic Elements (LEs) | — | 13824 |
| D-Flip-Flops | — | 13824 |
| RAM Bits | — | 110592 |
| User I/Os | — | 97 |
| Number of PLLs | — | 1 |
| Core Supply Voltage | — | 1.5 V |
| I/O Standards Supported | — | 3.3V, 2.5V, 1.8V, 1.5V |
| Maximum System Performance | — | 272 MHz |
| Maximum Internal Clock Frequency | — | 350 MHz |
| Hanay ng Temperature na Operasyon | — | -40°C to +100°C (industrial) |
| Technology | — | 130nm Flash |