A3P600-FGG256 vs A3P600-FG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-FGG256 sa pamamagitan ng Microchip Technology at A3P600-FG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-FGG256 - 600K Gate ProASIC3 FPGA | Microchip Technology
A3P600-FGG256 ✓ NakahandaMicrochip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-FGG256 | A3P600-FG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 (Flash FPGAs) |
| Number of System Gates | 600000 | — |
| Number of Logic Elements/Cells | 7KLEs (Mouser term) | — |
| Total RAM Bits | 110592 | — |
| Number of I/O | 177 | — |
| Voltage - Supply | 1.425V ~ 1.575V | — |
| Supply Voltage (Nominal) | 1.5V | — |
| Temperature na Operasyon | 0°C ~ 85°C (TJ) | 0 C to 85 C (TJ) |
| Packhaging / Kaso | 256-LBGA | — |
| Supplier Device Package | 256-FPBGA (17x17) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Tindminan RoHS | ROHS3 Compliant | RoHS non-compliant (per Microchip USA listing) |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | 8 weeks |
| Number of Terminals | 256 | — |
| Terminal Form | BALL | — |
| Package Shape | SQUARE | — |
| Maximum System Frequency | 231 MHz | — |
| System Gates | — | 600000 |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| User I/O | — | 177 |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | — | Approx. 231 MHz |
| Configuration Technology | — | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | — | Instant On Level 0 support |
| Packhaging | — | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| I/O Banks | — | 4 (independent VCCIBx supplies) |