A3PE3000-1FG324I vs A3PE3000L-1FG324I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-1FG324I sa pamamagitan ng Microchip Technology at A3PE3000L-1FG324I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
A3PE3000-1FG324I ✓ NakahandaMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-1FG324I | A3PE3000L-1FG324I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3000000 |
| Family | ProASIC3E | ProASIC3L Low Power Flash FPGA |
| Series | A3PE3000 | — |
| Number of I/Os | 221 | — |
| Maximum Operating Frequency | 272 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS flash |
| Packhaging / Kaso | 324-FBGA | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Quiescent Supply Current | 25 mA | — |
| Configuration Memory | Flash (non-volatile, single-chip) | Non-volatile on-chip flash (single chip, secure) |
| Programming Type | In-system reprogrammable | — |
| Packaging | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 35K LEs (75264 D-flip-flops equivalent family density) |
| User I/O | — | 221 |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Speed Grade | — | -1 |
| Low Power Feature | — | Flash*Freeze technology |
| Temperature na Operasyon | — | -40C to +100C (industrial, I suffix) |
| Packhaging | — | 324-ball FBGA (FG324) |
| Uri ng Pagpapasok | — | Surface Mount |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |