A3PE3000-1FGG484 vs A3PE3000L-FGG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-1FGG484 sa pamamagitan ng Microchip Technology at A3PE3000L-FGG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-1FGG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG484 ✓ NakahandaMicrochip Technology
A3PE3000L-FGG484I - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-FGG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-1FGG484 | A3PE3000L-FGG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | $1,425.71 | — |
| Family | ProASIC3E | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75264 | — |
| User I/O | 341 | — |
| Embedded Memory Bits | 516096 | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | -1 | — |
| Packhaging | 484-ball FBGA (FGG484) | 484-FPBGA (23 x 23 mm, 1 mm pitch, FBGA-484) |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1 mm | — |
| Package Height | 2.23 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| Temperature Grade | Commercial ([DATA_NEEDED: exact operating temperature range]) | — |
| Tindminan RoHS | Compliant (lead-free per Kynix listing) | RoHS3 Compliant |
| Logic Cells (CLBs) | — | 75264 |
| User I/Os (this package) | — | 341 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage Range | — | 1.14 V to 1.575 V |
| Configuration | — | Nonvolatile flash, Live-At-Power-Up (Level 0), single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Temperature na Operasyon | — | -40 C to +100 C (TJ), industrial (I) |
| Logic Family | — | CMOS |
| Packaging | — | Tray |
| Unit Price | — | [DATA_NEEDED: verified unit price not present in source data] |