A3PE3000-1FGG484 vs A3PE3000L-FGG484I Comparaison
Comparaison détaillée côte à côte de A3PE3000-1FGG484 par Microchip Technology et A3PE3000L-FGG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-1FGG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG484 ✓ ActifMicrochip Technology
A3PE3000L-FGG484I - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-FGG484I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-1FGG484 | A3PE3000L-FGG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 425,71 | $0,00 |
| Family | ProASIC3E | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75264 | — |
| User I/O | 341 | — |
| Embedded Memory Bits | 516096 | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | -1 | — |
| Boîtier | 484-ball FBGA (FGG484) | 484-FPBGA (23 x 23 mm, 1 mm pitch, FBGA-484) |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1 mm | — |
| Package Height | 2.23 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| Temperature Grade | Commercial ([DATA_NEEDED: exact operating temperature range]) | — |
| Statut RoHS | Compliant (lead-free per Kynix listing) | RoHS3 Compliant |
| Logic Cells (CLBs) | — | 75264 |
| User I/Os (this package) | — | 341 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage Range | — | 1.14 V to 1.575 V |
| Configuration | — | Nonvolatile flash, Live-At-Power-Up (Level 0), single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Température de fonctionnement | — | -40 C to +100 C (TJ), industrial (I) |
| Logic Family | — | CMOS |
| Packaging | — | Tray |
| Unit Price | — | [DATA_NEEDED: verified unit price not present in source data] |