A3PE3000-2FG484 vs A3PE3000L-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-2FG484 sa pamamagitan ng Microchip Technology at A3PE3000L-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FG484 ✓ NakahandaMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-2FG484 | A3PE3000L-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E Flash FPGAs | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells (DFF-equivalent) | 75,264 | — |
| VersaTiles | 75,264 | — |
| User I/O | 341 | — |
| Embedded SRAM | 516,096 bits | — |
| Core Voltage | 1.5 V | — |
| Technology | 130 nm CMOS flash process | 130 nm CMOS flash, nonvolatile |
| Maximum System Performance | 310 MHz | — |
| Speed Grade | -2 | — |
| Configuration | Non-volatile Flash (single-chip, instant-on) | Flash-based, Instant On, single-chip |
| Soft ARM Support | Yes (optional Cortex-M1 soft core) | — |
| Packhaging | 484-ball FBGA (FG484) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature (commercial) | 0C to +85C | — |
| Tindminan RoHS | Non-G suffix (standard package); G-suffix variants are RoHS-compliant | [DATA_NEEDED: RoHS compliance] |
| I/O Standards | Voltage-referenced I/O supported (VREF per minibank) | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Temperature na Operasyon | — | [DATA_NEEDED: Operating Temperature] |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |