A3PE3000L-1FG896I vs A3PE3000L-FGG896I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FG896I sa pamamagitan ng Microchip Technology at A3PE3000L-FGG896I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG896I ✓ NakahandaMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FG896I | A3PE3000L-FGG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | — |
| User I/O | 620 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Process Technology | 130 nm CMOS flash | — |
| Maximum Frequency | 892.86 MHz | — |
| Packhaging | 896-ball FBGA (FG896), 1.00 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMD/SMT) |
| Temperature na Operasyon | -40C to +85C (Industrial) | Industrial grade (I suffix) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) | — |
| Low Power Feature | Flash*Freeze Technology | — |
| JTAG Boundary Scan | IEEE 1149.1 | — |
| Input Options | Schmitt trigger option on single-ended inputs | — |
| Pull Options | Weak pull-up / pull-down | — |
| Reprogrammability | Live reprogrammable | — |
| Speed Grade | -1 | Standard (no speed suffix) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Volte ng Pagbibigay | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Packhaging / Kaso | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |