A3PE3000L-1FGG484 vs A3PE3000-1FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG484 sa pamamagitan ng Microchip Technology at A3PE3000-1FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ NakahandaMicrochip Technology
A3PE3000-1FGG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG484 | A3PE3000-1FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | — | $1,425.71 |
| Family | ProASIC3L | ProASIC3E |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75264 |
| User I/Os (this package) | 341 | — |
| Maximum User I/Os (family) | 616 | — |
| Embedded SRAM | Up to 504 kbits true dual-port | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage (I/O) | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) | — |
| Speed Grade | -1 | -1 |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Configuration | Nonvolatile flash, Instant On, single chip | — |
| Low Power Feature | Flash*Freeze technology | — |
| Packhaging | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch | 484-ball FBGA (FGG484) |
| Style ng Pagpapasok | SMD/SMT | — |
| Temperature na Operasyon | 0C to +70C | — |
| Packaging | Tray | — |
| Power-Up Mode | Live at power-up (Level 0 support) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free per Kynix listing) |
| User I/O | — | 341 |
| Embedded Memory Bits | — | 516096 |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1 mm |
| Package Height | — | 2.23 mm |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Memory | — | On-chip flash (non-volatile, single-chip) |
| Temperature Grade | — | Commercial ([DATA_NEEDED: exact operating temperature range]) |