A3PE3000L-1FGG484I vs A3PE3000-1FGG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG484I sa pamamagitan ng Microchip Technology at A3PE3000-1FGG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ NakahandaMicrochip Technology
A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
A3PE3000-1FGG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG484I | A3PE3000-1FGG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | — |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Volte ng Pagbibigay | 1.14 V to 1.575 V | 1.5 V |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Packhaging / Kaso | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (TJ) | 0 to 70 C (per Digchip listing; confirm I-grade limits) |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | — |
| Tindminan RoHS | ROHS3 Compliant | Compliant (FGG green package) |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| Product Family | — | ProASIC3E |
| System Gates | — | 3,000,000 (3M) |
| Logic Elements | — | 35,000 |
| Embedded SRAM | — | 504 Kbits (516,096 bits) |
| User I/O (FGG484) | — | 341 |
| Total Balls | — | 484 |
| Packhaging | — | 484-ball FBGA, 1.0 mm pitch (FGG484) |
| Logic Family | — | CMOS |
| System Performance | — | 231 MHz |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Max User I/O (Family) | — | 616 |