A3PE3000L-1FGG896M vs A3PE3000L-1FGG896 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG896M sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG896 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG896M - 3M Gate ProASIC3L Low Power FPGA | Microchip
A3PE3000L-1FGG896M ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG896M | A3PE3000L-1FGG896 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Logic Elements | 35 KLEs (per Mouser listing) | — |
| Number of I/O | 620 | — |
| Total Memory Bits (DigiKey listing) | 516096 | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130 nm Flash | 130 nm flash |
| Configuration Technology | Flash (nonvolatile, single-chip) | — |
| Low Power Feature | Flash*Freeze technology | — |
| Packhaging | 896-ball FBGA | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supply Voltage - I/O | as low as 1.2 V (per Microchip product page) | — |
| Speed Grade | -1 | -1 |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Cells | — | 75264 |
| User I/O | — | 620 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |