A3PE3000L-FG484 vs A3PE3000-2FG484 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG484 sa pamamagitan ng Microchip Technology at A3PE3000-2FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
A3PE3000L-FG484 A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 ✓ Nakahanda
Microchip Technology
A3PE3000-2FG484 A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FG484 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro A3PE3000L-FG484 A3PE3000-2FG484
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family ProASIC3L (Low Power Flash FPGA) ProASIC3E Flash FPGAs
System Gates 3000000 3,000,000
Logic Cells / CLBs 75264 —
User I/Os 341 —
Maximum System Frequency 250 MHz —
Core Voltage Range 1.2 V to 1.5 V —
Technology 130 nm CMOS flash, nonvolatile 130 nm CMOS flash process
Configuration Flash-based, Instant On, single-chip Non-volatile Flash (single-chip, instant-on)
Low Power Feature Flash*Freeze technology —
Package Type 484-ball FBGA (PBGA484) —
Package Dimensions 23 x 23 mm, 1 mm ball pitch —
Package Height 2.23 mm —
Uri ng Pagpapasok Surface Mount Surface Mount
Process CMOS —
Temperature na Operasyon [DATA_NEEDED: Operating Temperature] —
Supply Voltage I/O [DATA_NEEDED: I/O supply voltage range] —
Embedded Memory [DATA_NEEDED: Embedded RAM block capacity] —
Tindminan RoHS [DATA_NEEDED: RoHS compliance] Non-G suffix (standard package); G-suffix variants are RoHS-compliant
Logic Cells (DFF-equivalent) — 75,264
VersaTiles — 75,264
User I/O — 341
Embedded SRAM — 516,096 bits
Core Voltage — 1.5 V
Maximum System Performance — 310 MHz
Speed Grade — -2
Soft ARM Support — Yes (optional Cortex-M1 soft core)
Packhaging — 484-ball FBGA (FG484)
Operating Temperature (commercial) — 0C to +85C
I/O Standards — Voltage-referenced I/O supported (VREF per minibank)

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