A3PE3000L-FG484M vs A3PE3000L-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG484M sa pamamagitan ng Microchip Technology at A3PE3000L-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ NakahandaMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG484M | A3PE3000L-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 (3.00E6) | 3000000 |
| Logic Elements (VersaTiles) | 75264 | — |
| True Dual-Port SRAM | 504 kbits | — |
| User I/O | 341 (up to 616 in larger packages) | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS | — |
| Logic Family | CMOS | — |
| Configuration Memory | Nonvolatile on-chip flash, live at power-up (Level 0) | — |
| Low-Power Feature | Flash*Freeze technology | — |
| Temperature na Operasyon | 0 to 70 C | [DATA_NEEDED: Operating Temperature] |
| Volte ng Pagbibigay | 1.5 V | — |
| Package Type | FBGA-484, 1 mm pitch, 23 x 23 mm | 484-ball FBGA (PBGA484) |
| Pins / Balls | 484 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Single-Chip Solution | Yes (no external configuration device required) | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Configuration | — | Flash-based, Instant On, single-chip |
| Low Power Feature | — | Flash*Freeze technology |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance] |