A3PE3000L-FG896I vs A3PE3000L-1FGG896 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG896I sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG896 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
A3PE3000L-FG896I ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG896I | A3PE3000L-1FGG896 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Logic Cells | 75264 | 75264 |
| User I/O | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| I/O Voltage (minimum) | 1.2 V | — |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | Nonvolatile flash (single-chip) |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) | — |
| Packhaging | 896-BGA (FBGA-896) | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature Grade | Industrial (-I suffix) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Tindminan RoHS | RoHS Non-Compliant (per distributor listing) | — |
| Lead Free Status | Contains Lead (per distributor listing) | — |
| Speed Grade | [DATA_NEEDED: speed grade / grade code] | -1 |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: exact operating temperature range in C] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM block capacity] | — |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Process Technology | — | 130 nm flash |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |