A3PE3000L-FGG896I vs A3PE3000-FG896I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FGG896I sa pamamagitan ng Microchip Technology at A3PE3000-FG896I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ NakahandaMicrochip Technology
A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip
A3PE3000-FG896I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FGG896I | A3PE3000-FG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3E Flash Family FPGAs |
| System Gates | 3000000 | 3M gates |
| Total RAM Bits | 516096 bits | — |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) | — |
| Number of I/O | 620 | — |
| Volte ng Pagbibigay | 1.14 V to 1.575 V | — |
| Core Voltage Support | 1.2 V to 1.5 V | — |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based | — |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 | — |
| Special Features | Flash*Freeze technology, single-chip solution | — |
| Packhaging / Kaso | 896-BGA (FBGA, 1 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount |
| Temperature na Operasyon | Industrial grade (I suffix) | — |
| Packaging | Tray, standard quantity 27 | Tray |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant: Yes |
| Speed Grade | Standard (no speed suffix) | — |
| Logic Elements | — | 35KLEs |
| User I/Os | — | 620 |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash |
| Configuration Memory | — | Nonvolatile Flash (single-chip, Instant On) |
| Packhaging | — | 896-Pin FBGA (896-BGA) |
| Package Dimensions | — | 31 x 31 x 2.44 mm |
| Terminal Form | — | Ball |
| Hanay ng Temperature na Operasyon | — | Industrial (-40C to +85C) |
| Temperature Grade | — | I (Industrial) |
| Programming Support | — | Reprogrammable, Cortex-M1 soft processor support |