A3PE600-2FG256I vs M7AFS600-2FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600-2FG256I sa pamamagitan ng Microchip Technology at M7AFS600-2FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600-2FG256I - ProASIC3E FPGA 600K Gates | Microchip
A3PE600-2FG256I ✓ NakahandaMicrochip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600-2FG256I | M7AFS600-2FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E (Flash FPGA) | Fusion Mixed-Signal FPGA (Actel/Microchip) |
| System Gates | 600000 gates | 600000 |
| Logic Elements (VersaTiles) | [DATA_NEEDED: number of VersaTiles] | — |
| Number of I/O | 165 | — |
| Embedded Memory (RAM bits) | 110592 bits | — |
| Maximum System Frequency | 310 MHz | — |
| Speed Grade | -2 | -2 |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal, flash-based CMOS |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| Temperature na Operasyon | -40C to +85C (industrial) | 0 to 70 C |
| Packhaging | 256-LBGA / FBGA (FG256) | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Package Height | 1.80 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | RoHS Non-Compliant (contains lead, per distributor data) | — |
| Lead Free Status | Contains Lead | — |
| Total Cost of Ownership Feature | Low TOC, single-chip solution, reprogrammable | — |
| User I/O | — | 119 |
| Flash Memory Blocks | — | 110592 bits |
| Processor Support | — | ARM CoreMP7 |
| System Performance | — | 350 MHz |
| Volte ng Pagbibigay | — | 1.5 V (core) |
| Logic Family | — | CMOS |
| Configuration | — | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) |
| Number of Pins/Balls | — | 256 |
| Packaging | — | Tray |