A3PE600-FG484M vs A3P600L-FGG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600-FG484M sa pamamagitan ng Microchip Technology at A3P600L-FGG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FG484M ✓ NakahandaMicrochip Technology
A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip
A3P600L-FGG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600-FG484M | A3P600L-FGG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E (Flash-Based FPGA) | — |
| System Gates | 600000 | — |
| Logic Elements / Cells | 13824 | — |
| CLBs | 13824 | — |
| Maximum User I/O | 270 | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| Maximum System Frequency | 231 MHz | — |
| Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage Range | 1.14 V to 1.575 V (nominal 1.5 V) | — |
| Configuration | Live-at-power-up flash fabric, single-chip (no external boot device) | Non-volatile flash, instant-on |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Packhaging | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray (M suffix) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (Green) |
| Distributor Stock Reference | 4480 pieces (Heisener listing) | — |
| Product Series | — | ProASIC3L |
| FPGA Family | — | Flash FPGA |
| Total System Gates | — | 600000 |
| Logic Elements | — | 13824 |
| User I/Os | — | 235 |
| Maximum System Performance | — | 350 MHz |
| Core Supply Voltage | — | 1.2 V to 1.5 V |
| Technology Node | — | 130 nm CMOS |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 mm x 23 mm |
| Package Height | — | 2.23 mm |
| Ball Pitch | — | 1 mm |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: industrial grade temperature range] |
| Low Power Mode | — | Flash*Freeze |