A3PE600-FGG256I vs A3PE600-1FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600-FGG256I sa pamamagitan ng Microchip Technology at A3PE600-1FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ NakahandaMicrochip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600-FGG256I | A3PE600-1FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 600000 gates | 600000 |
| Logic Elements (VersaTiles) | 13824 | — |
| User I/O | 165 | 165 |
| Embedded Flash Memory | 110592 bits | — |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| Maximum Internal Performance | 350 MHz | — |
| Packhaging | 256-FBGA (S-PBGA-B256), 17 x 17 mm | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Ball Pitch | 1.0 mm | — |
| Package Height | 1.6 mm | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | -40C to +100C (TJ), industrial |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) | On-chip Flash (Live at Power-Up, Level 0) |
| Tindminan RoHS | Compliant (lead free) | [DATA_NEEDED: RoHS compliance status] |
| Process Technology | CMOS flash FPGA | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Footprint Compatibility | FG256 and FG484 footprint-compatible packages | — |
| Logic Cells | — | 13824 |
| Embedded SRAM | — | 110592 bits (up to 504 kbits family density) |
| Maximum System Performance | — | 272 MHz |
| Logic Family | — | CMOS |
| Speed Grade | — | -1 |
| Reprogrammability | — | Yes (single-chip, no external boot PROM) |
| Typical Application Domains | — | Industrial, communications, medical, aerospace/defense |