A3PE600L-FGG484M vs A3PE600-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600L-FGG484M sa pamamagitan ng Microchip Technology at A3PE600-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600L-FGG484M - ProASIC3EL Flash FPGA 600K | Microchip
A3PE600L-FGG484M ✓ NakahandaMicrochip Technology
A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600L-FGG484M | A3PE600-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3EL | ProASIC3E (Flash FPGA) |
| Logic Elements | 7K (per distributor listing) | — |
| System Gates | 600K | 600000 |
| User I/O | 270 | — |
| User Flash Memory | 110592 bits | — |
| Core Voltage | 1.2 V to 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS flash | — |
| Configuration Memory | On-chip Flash (nonvolatile, reprogrammable) | — |
| Packhaging | 484-Ball FBGA (484-BGA) | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Speed Grade | [DATA_NEEDED: speed grade] | — |
| Flash*Freeze Technology | Supported (ProASIC3/EL military datasheet) | — |
| Neutron-Induced Configuration Loss | Not susceptible (per datasheet) | — |
| Device Screening | Each device tested from -55C to 125C (per datasheet) | — |
| Programming Tool | Microchip Libero SoC | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Cells (CLBs) | — | 13824 |
| User I/Os | — | 270 |
| Embedded Memory | — | 110592 |
| Maximum System Frequency | — | 231 MHz |
| Technology | — | 130 nm CMOS flash |
| Package Height | — | 2.23 mm |
| Configuration | — | Nonvolatile flash (single-chip, no external configuration PROM) |
| Package Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Soft Processor Support | — | Soft ARM support |
| Packaging | — | Tray |