AFS600-1FGG256 vs M7AFS600-FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-1FGG256 sa pamamagitan ng Microchip Technology at M7AFS600-FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ NakahandaMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-1FGG256 | M7AFS600-FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| System Gates | 600,000 gates | 600K |
| User I/O | 119 I/O | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Logic Family | Flash-based CMOS | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Package Type | 256-ball FBGA | — |
| Package Pin Count | 256 balls | — |
| Package Pitch | 1.0 mm | — |
| Temperature na Operasyon | 0°C to 70°C | — |
| Configuration Memory | Embedded nonvolatile flash | — |
| Power-Up Configuration | Live at power-up | — |
| Integrated Analog Resources | Configurable analog blocks | — |
| Integrated Clock Management | Clock generation and management | — |
| Embedded Memory | Large flash memory blocks | — |
| Package Family | FBGA surface-mount package family | — |
| Tindminan RoHS | RoHS compliant | — |
| Lead-Free Status | Lead-free | — |
| Pin Assignments | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Packhaging / Kaso | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Style ng Pagpapasok | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |