AFS600-2FG256 vs M7AFS600-FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-2FG256 sa pamamagitan ng Microchip Technology at M7AFS600-FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-2FG256 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-2FG256 ✓ NakahandaMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-2FG256 | M7AFS600-FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| System Gates | 600000 gates | 600K |
| Programmable Logic Blocks | 13824 CLBs | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm flash-based CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Bilang ng Pins | 256 pins | — |
| I/O Count | 119 I/O | — |
| Package Type | FBGA-256, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0°C to 85°C (32°F to 185°F) | — |
| Junction Temperature Test | 100°C | — |
| Configuration Memory | Flash-based, nonvolatile | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Analog Resources | Configurable analog blocks | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Product Family | Fusion mixed-signal FPGA | — |
| Tindminan RoHS | unknown | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Packhaging / Kaso | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Style ng Pagpapasok | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |