AFS600-FG256 vs AFS600-FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-FG256 sa pamamagitan ng Microchip Technology at AFS600-FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-FG256 - 600K Mixed-Signal Fusion FPGA | Microchip
AFS600-FG256 ✓ NakahandaMicrochip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-FG256 | AFS600-FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600,000 gates |
| User I/O Count | 119 I/Os | — |
| Embedded Memory | 110,592 bits | — |
| Volte ng Pagbibigay | 1.5 V | 1.5 V |
| Logic Family | CMOS | CMOS |
| Process Technology | 130 nm | 130 nm CMOS |
| Metal Layers | 7 layers | 7 layers |
| Configuration Memory | Nonvolatile flash-based CMOS | Nonvolatile flash memory |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Package Type | 256-pin low-profile BGA | 256-LBGA |
| Package Pitch | 1.0 mm | 1.0 mm |
| Bilang ng Pin | 256 pins | — |
| Temperature na Operasyon | 0 C to 70 C | 0 C to 70 C |
| Device Type | FPGA | Fusion mixed-signal FPGA |
| Analog Capability | Configurable analog blocks | — |
| Clock Capability | Integrated clock generation and management circuitry | — |
| Maximum Frequency | 1098.9 MHz | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification status] |
| Configurable Logic Blocks | — | 13,824 CLBs |
| User I/O | — | 119 I/O |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Number of Package Balls | — | 256 balls |
| Package Shape | — | Square |
| Uri ng Pagpapasok | — | Surface mount |