AFS600-FGG256 vs M1AFS600-1FGG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-FGG256 sa pamamagitan ng Microchip Technology at M1AFS600-1FGG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-FGG256 | M1AFS600-1FGG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Unknown | Aktibo |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600000 |
| Configurable Logic Cells | 13,824 cells | — |
| I/O Count | 119 I/Os | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm | 130 nm CMOS, flash-based |
| Metal Layers | 7 layers | — |
| Configuration Memory | Flash-based nonvolatile memory | Flash (non-volatile, live at power-up) |
| Configuration Feature | Live at Power-Up (LAPU) | — |
| Maksimum na Taktiko ng Oras | 1098.9 MHz | — |
| Temperature na Operasyon | 0°C to 70°C | 0C to +85C |
| Package Type | 256-pin FBGA | — |
| Package Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface mount | Surface Mount |
| Packing Media | Tray | — |
| RoHS | Compliant | — |
| Family | — | Fusion Mixed-Signal FPGA |
| Processor Core | — | ARM Cortex-M1 (hard core) |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Core Supply Voltage | — | 1.5 V |
| Packhaging | — | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| Tindminan RoHS | — | Compliant |
| Packaging | — | Tray |