ATSAM4SD32CA-CU vs ATSAM4SD32CB-CFN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAM4SD32CA-CU sa pamamagitan ng Microchip Technology at ATSAM4SD32CB-CFN sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAM4SD32CA-CU - 120MHz Cortex-M4 MCU 2MB Flash 100-TFBGA | Microchip
ATSAM4SD32CA-CU ✓ NakahandaMicrochip Technology
ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip
ATSAM4SD32CB-CFN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAM4SD32CA-CU | ATSAM4SD32CB-CFN |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU and MPU |
| Maksimum na Taktiko ng Oras | 120 MHz | — |
| Instruction Cache | 2 KB | — |
| Program Memory (Flash) | 2 MB (2M x 8) | — |
| SRAM | 160 KB | 160 KB |
| Supply Voltage Range | 1.62 V to 3.6 V | — |
| Packhaging | 100-ball TFBGA (9x9 mm) | 100-ball VFBGA, 7x7 mm, 0.65 mm pitch |
| Hanay ng Temperature na Operasyon | -40 C to +85 C (industrial) | — |
| ADC | 10-bit, up to 16 channels, 1 MSps | 12-bit, up to 16 channels |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG | Full-speed USB Device with on-chip transceiver |
| CAN | 2 x CAN 2.0A/B | — |
| USART | 3 x USART | — |
| TWI (I2C-compatible) | 2 x TWI | — |
| SPI | 2 x SPI | — |
| Memory Protection Unit (MPU) | Yes | — |
| DSP Extensions | Yes (single-precision FPU + MAC) | — |
| Pin-to-Pin Compatibility | SAM3N, SAM3S, SAM7S legacy 64/100-pin variants | — |
| Uri ng Pagpapasok | Surface Mount (TFBGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant (Pb-free) |
| Maximum CPU Clock | — | 120 MHz |
| Flash Memory | — | 2 MB (2048 KB) |
| Cache | — | Up to 4 KB (Flash controller cache) |
| Core Mark / DMIPS | — | 1.25 DMIPS/MHz (150 DMIPS at 120 MHz) |
| Operating Voltage (VDDIO/VDDIN) | — | 1.62 V to 3.6 V |
| Core Voltage (internal) | — | 1.2 V (internal LDO) |
| Communication Interfaces | — | 5x USART, 3x SPI, 2x TWI (I2C), 1x HS USB, 1x CAN, 1x SSC, 1x EMAC |
| DMA Channels | — | 16 peripheral DMA channels |
| Timers | — | Two 16-bit TC channels, one 16-bit PWM, one RTC, one RTT |
| Operating Temperature (Grade) | — | -40C to +85C (industrial) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020, reflow at 260C) |
| Lead-free / Halogen-free | — | Lead-free (green) per Microchip data |