ATSAMA5D21B-CU vs ATSAMA5D22B-CNR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D21B-CU sa pamamagitan ng Microchip Technology at ATSAMA5D22B-CNR sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D21B-CU - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip
ATSAMA5D21B-CU ✓ NakahandaMicrochip Technology
ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip
ATSAMA5D22B-CNR ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D21B-CU | ATSAMA5D22B-CNR |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Microchip Technology | — |
| Series | SAMA5D2 | — |
| Core Processor | ARM Cortex-A5 | — |
| Core Count | 1 | 1 |
| Width ng Data Bus | 32-bit | — |
| Maximum CPU Clock | 500 MHz | — |
| Packhaging | 196-TFBGA (11x11 mm) | 196-TFBGA (11x11x1.2 mm) |
| Ball Pitch | 0.8 mm | 0.8 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +85C | -40C to +105C (extended) |
| External Memory Support | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC | — |
| Co-processors | NEON MPE, FPU | — |
| Backup Mode Current | 5 uA (typical) | — |
| Security Features | AES, SHA, TRNG, Secure Boot, Tamper Detection | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | — |
| Architecture | — | ARM Cortex-A5 (ARMv7-A) |
| Data Width | — | 32-bit |
| Maksimum na Taktiko ng Oras | — | 500 MHz |
| Core Supply Voltage | — | 1.2 V |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Cache | — | 128 KB (configurable as SRAM) |
| NEON Media Processing Engine | — | Yes |
| Floating Point Unit | — | Yes |
| ARM TrustZone | — | Yes |
| Peripheral Touch Controller (PTC) | — | Yes |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |
| Packaging | — | Tape & Reel (T&R) |