ATSAMA5D21C-CU vs ATSAMA5D21C-CUR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D21C-CU sa pamamagitan ng Microchip Technology at ATSAMA5D21C-CUR sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D21C-CU - 500MHz Cortex-A5 MPU | Microchip 196-TFBGA
ATSAMA5D21C-CU ✓ NakahandaMicrochip Technology
ATSAMA5D21C-CUR - ARM Cortex-A5 MPU 500MHz 196-TFBGA | Microchip
ATSAMA5D21C-CUR ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D21C-CU | ATSAMA5D21C-CUR |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Microchip Technology | — |
| Series | SAMA5D2 | — |
| Core Processor | ARM Cortex-A5 | ARM Cortex-A5 |
| Number of Cores | 1 | — |
| Bit Width | 32-bit | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 128 KB | — |
| Packhaging | 196-TFBGA 11x11 mm, 0.8 mm pitch | 196-TFBGA (11x11 mm) |
| Integrated DRAM | Up to 1 Gbit DDR2 or 2 Gbit LPDDR2 SDRAM (SiP) | — |
| External Memory Bus | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, eMMC, SD/MMC | — |
| Ethernet | 10/100/1000 Mbps with IEEE 1588 PTP | 10/100 Mbps (1x) |
| USB | USB HS Host + Device, USB FS Host + Device | USB 2.0 + HSIC |
| CAN | 2x CAN-FD | — |
| Other Connectivity | 2x SD/SDIO/MMC, I2C, SPI, UART, I2S | — |
| ADC | 12-bit ADC | — |
| Graphics | LCD controller (up to 1024x768) | — |
| Crypto Accelerators | AES, SHA, TRNG, secure boot, tamper detection | — |
| Audio | Class D amplifier, I2S, S/PDIF | — |
| Backup Mode Current | 5 uA | 5 µA |
| Hanay ng Temperature na Operasyon | -40C to +85C (industrial) | — |
| Grade | Industrial (green, MRLC) | — |
| Uri ng Pagpapasok | Surface Mount (TFBGA) | Surface Mount (BGA) |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant | — |
| Core Count | — | 1 |
| Width ng Data Bus | — | 32-bit |
| On-chip ROM | — | 160 KB |
| Ball Pitch | — | 0.8 mm |
| Supply Voltage (Core) | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| External Memory Support | — | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Temperature na Operasyon | — | -40 °C to +85 °C (industrial) |