ATSAMA5D22B-CNR vs ATSAMA5D27C-D5M-CU Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D22B-CNR sa pamamagitan ng Microchip Technology at ATSAMA5D27C-D5M-CU sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip
ATSAMA5D22B-CNR ✓ NakahandaMicrochip Technology
ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip
ATSAMA5D27C-D5M-CU ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D22B-CNR | ATSAMA5D27C-D5M-CU |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Architecture | ARM Cortex-A5 (ARMv7-A) | — |
| Core Count | 1 | — |
| Data Width | 32-bit | — |
| Maksimum na Taktiko ng Oras | 500 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 128 KB (configurable as SRAM) | — |
| NEON Media Processing Engine | Yes | — |
| Floating Point Unit | Yes | — |
| ARM TrustZone | Yes | — |
| Peripheral Touch Controller (PTC) | Yes | — |
| Embedded Audio Subsystem | Yes (I2S/TDM) | — |
| Packhaging | 196-TFBGA (11x11x1.2 mm) | — |
| Ball Pitch | 0.8 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +105C (extended) | -40°C to +85°C (Industrial) |
| Packaging | Tape & Reel (T&R) | — |
| Tindminan RoHS | Compliant | Compliant |
| Part Status | — | Active |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores / Bus Width | — | 1 Core, 32-Bit |
| Speed | — | 500 MHz |
| Co-Processors / DSP | — | ARM NEON, FPU |
| RAM Controllers | — | DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) |
| Graphics Acceleration | — | Yes (2D) |
| Peripheral Touch Controller | — | Yes (16-bit databus) |
| Audio Subsystem | — | I2S, class-D amplifier interface |
| Ethernet | — | Dual 10/100 GMAC with 1588 PTP |
| USB | — | USB HSIC + 2x USB 2.0 High-Speed |
| CAN | — | 2x CAN-FD |
| Serial Interfaces | — | 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART |
| Image Sensor Interface | — | Yes |
| Packhaging / Kaso | — | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) |