ATSAMA5D27-SOM1-EK1 vs ATSAMA5D27A-CU Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D27-SOM1-EK1 sa pamamagitan ng Microchip Technology at ATSAMA5D27A-CU sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D27-SOM1-EK1 - SAMA5D27 ARM Cortex-A5 500MHz Eval Kit
ATSAMA5D27-SOM1-EK1 ✓ NakahandaMicrochip Technology
ATSAMA5D27A-CU - 500MHz Cortex-A5 MPU | Microchip | Embedded
ATSAMA5D27A-CU ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D27-SOM1-EK1 | ATSAMA5D27A-CU |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Development Boards | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Type | Embedded Evaluation Board / Development Kit | — |
| Target Module | ATSAMA5D27-SOM1 | — |
| Embedded SiP | ATSAMA5D27C-D1G-CU (Cortex-A5 + 1-Gbit DDR2) | — |
| Processor Core | ARM Cortex-A5 | — |
| Maximum Core Frequency | 500 MHz | — |
| DDR2 SDRAM | 1 Gbit (128 MB) on SiP | — |
| NOR Flash | 64 Mbit | — |
| EEPROM | 1 Kbit | — |
| Operating System Support | Linux, RTOS (Buildroot, Yocto, mainline Linux) | — |
| Debug Interface | On-board debugger, JTAG/SWD headers | — |
| Connectivity | USB Host/Device, GMII/RGMII Ethernet expansion, CAN, SD/MMC x2, mikroBUS x2, Audio codec, LCD/touch connector | — |
| Expansion Headers | 0.1-inch headers mapping SAMA5D2 peripheral pins | — |
| Documentation | 60-page SAMA5D27 SOM1 Kit1 User's Guide | — |
| Uri ng Pagpapasok | Through-hole / desktop development board | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-A5 (ARMv7-A) with NEON |
| Operating Frequency | — | 500 MHz |
| Core Count / Data Bus Width | — | 1 Core / 32-bit |
| Internal SRAM | — | 128 KB |
| External Memory Support | — | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND |
| Packhaging | — | 289-LFBGA (14x14 mm, 0.8 mm pitch) |
| Volte ng Pagbibigay | — | 3.3 V I/O, 1.2 V core (typ.) |
| Backup Mode Current | — | <5 µA |
| Temperature na Operasyon | — | -40 °C to +85 °C (industrial) |
| Cryptography | — | AES, SHA, TRNG, secure boot |
| Display Interface | — | LCD controller, MIPI-DSI option |
| Touch Controller | — | Integrated Peripheral Touch Controller (PTC) |
| Communication Interfaces | — | CAN, HSIC, USB, EMAC, FLEXCOM x12 (UART/SPI/TWI) |
| Level ng MSL | — | 3 |
| Lead-Free | — | Yes |