EP1AGX50CF484C3 vs EP1AGX50CF484I6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1AGX50CF484C3 sa pamamagitan ng Intel at EP1AGX50CF484I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1AGX50CF484C3 | EP1AGX50CF484I6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Arria GX | Arria GX |
| Logic Elements | 50,160 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total RAM Bits | 2,475,072 bits | — |
| M4K Memory Blocks | 4,506 | — |
| M-RAM Blocks | 252 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Channels | 12 (up to 3.125 Gbps) | — |
| User I/O Pins | 232 | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (FC-FBGA), 1.0 mm pitch |
| Speed Grade | C3 (commercial, fastest) | I6 (industrial) |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Method | Passive serial, Fast passive parallel, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Process Technology | 90 nm | 90 nm |
| Logic Elements (LEs) | — | 50160 |
| Package Code | — | S-PBGA-B484 |
| Maximum User I/O | — | 229 |
| Number of Terminals | — | 484 |
| Package Shape | — | Square |
| Embedded Memory | — | 2475072 bits |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: multiplier count] |
| Transceiver Count | — | Up to 12 (3.125 Gbps) |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Passive serial, passive parallel, JTAG |
| PLL Count | — | Up to 8 |
| Level ng MSL | — | 3 |
| Uri ng Pagpapasok | — | Surface Mount |
| Body Material | — | Plastic / Epoxy |