EP1C12F324C8NGA vs EP1C12F324C8L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C12F324C8NGA sa pamamagitan ng Intel at EP1C12F324C8L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C12F324C8NGA | EP1C12F324C8L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Logic Elements (LE) | 12,060 | — |
| Total RAM Bits | 239,616 | — |
| Number of User I/O | 249 | — |
| Number of Logic Array Blocks (LAB) | 1,206 | — |
| Embedded 18x18 Multipliers | 52 | — |
| PLLs | 2 | 2 |
| Packhaging | 324-BGA (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | FBGA-324 |
| Speed Grade | 8 (commercial) | 8 |
| Temperature na Operasyon | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.13 µm SRAM | CMOS, 130 nm |
| Configuration Mode | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Power Variant | — | Low-power (L suffix) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |