EP1K100FI256-2N vs EP1K50FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K100FI256-2N sa pamamagitan ng Intel at EP1K50FI256-2N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K100FI256-2N | EP1K50FI256-2N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX 1K | — |
| Series | EP1K100 | ACEX-1K |
| Logic Elements | 4,992 | 2,880 |
| System Gates | 100,000 | — |
| Logic Array Blocks (LABs) | 624 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Total RAM Bits | 49,152 | 40,960 |
| Maximum User I/O | 186 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Speed Grade | -2 (faster bin) | — |
| Ball Finish | Leaded (SnPb) - 'N' suffix | — |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Packhaging | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.8 mm height |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) + serial modes | — |
| Tindminan RoHS | Non-compliant (leaded 'N' ball finish) | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | Intel (formerly Altera) |
| Number of LABs/CLBs | — | 360 |
| Number of Gates | — | 50,000 (typical); 199,000 (maximum) |
| Number of I/O Pins | — | 186 (maximum) |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Operating Frequency (max) | — | 200 MHz (internal) |
| Configuration Method | — | SRAM - serial/parallel, JTAG (IEEE 1149.1), EPC configuration PROM |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free / halogen-free status] |