EP1K30FI256-2N vs EP1K30FI256-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FI256-2N sa pamamagitan ng Intel at EP1K30FI256-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30FI256-2N | EP1K30FI256-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Typical Gates | 30,000 | — |
| Logic Elements (LEs) | 1,728 | 1728 |
| Embedded RAM Bits | 24,576 | 24,576 bits |
| Maximum User I/O | 171 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Number of LABs | 216 | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Speed Grade | -2 | -2 |
| Programmable via | JTAG (IEEE 1149.1) | — |
| Uri ng Memory | Dual-port Embedded Array Block (EAB) | — |
| Typical Gate Count | — | 30,000 gates |
| Logic Array Blocks (LABs) | — | 216 |
| User I/O Pins | — | 171 |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (2.5 V typical) |
| Temperature na Operasyon | — | -40 °C to +85 °C (Industrial) |
| Configuration Interface | — | JTAG / Serial / ByteBlaster |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status not in verified web data] |