EP1K30FI256-2N vs EP1K30FI256-2 Comparison
Detailed side-by-side comparison of EP1K30FI256-2N by Intel and EP1K30FI256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K30FI256-2N | EP1K30FI256-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Typical Gates | 30,000 | — |
| Logic Elements (LEs) | 1,728 | 1728 |
| Embedded RAM Bits | 24,576 | 24,576 bits |
| Maximum User I/O | 171 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Number of LABs | 216 | — |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Speed Grade | -2 | -2 |
| Programmable via | JTAG (IEEE 1149.1) | — |
| Memory Type | Dual-port Embedded Array Block (EAB) | — |
| Typical Gate Count | — | 30,000 gates |
| Logic Array Blocks (LABs) | — | 216 |
| User I/O Pins | — | 171 |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (2.5 V typical) |
| Operating Temperature | — | -40 °C to +85 °C (Industrial) |
| Configuration Interface | — | JTAG / Serial / ByteBlaster |
| RoHS Status | — | [DATA_NEEDED: RoHS status not in verified web data] |