EP1K50FC256-1N vs EP1K50FC256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50FC256-1N sa pamamagitan ng Intel at EP1K50FC256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K50FC256-1N | EP1K50FC256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Series | ACEX-1K (2.5 V) | — |
| Maximum Logic Elements | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Typical Gates | 50,000 | 50,000 |
| Maximum System Gates | 199,000 | — |
| Embedded Memory (EAB) Bits | 40,960 bits | — |
| User I/O Pins | 186 | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Maximum Internal Frequency | 250 MHz | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS SRAM |
| Typical Operating Current | 5 mA | — |
| Speed Grade | -1 (commercial) | -2 |
| Temperature na Operasyon | 0 C to 70 C (commercial) | 0 °C to 70 °C (Commercial) |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead Status | Lead-free (-N suffix) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) | JTAG / Passive Serial |
| Logic Elements (LEs) | — | 2,880 |
| Embedded Memory (bits) | — | 40,960 |
| Embedded Array Blocks (EABs) | — | 10 |
| Maximum User I/O Pins | — | 186 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| Package Dimensions | — | 16 x 16 mm |