EP1K50FC256-2N vs EP1K50FC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50FC256-2N sa pamamagitan ng Intel at EP1K50FC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1K50FC256-3 - 50K-Gate ACEX-1K FPGA, 256-BGA | Intel / Altera
EP1K50FC256-3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1K50FC256-2N | EP1K50FC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements (LEs) | 2,880 | 2,880 |
| Typical Gates | 50,000 | 50,000 |
| Embedded Memory (bits) | 40,960 | — |
| Embedded Array Blocks (EABs) | 10 | 12 |
| Logic Array Blocks (LABs) | 360 | 360 |
| Maximum User I/O Pins | 186 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| Temperature na Operasyon | 0 °C to 70 °C (Commercial) | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 um CMOS |
| Speed Grade | -2 | -3 |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-pin FineLine BGA (FBGA-256) |
| Package Dimensions | 16 x 16 mm | 17 x 17 mm |
| Configuration Method | JTAG / Passive Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | ACEX-1K |
| Embedded RAM Bits | — | 40,960 |
| Maximum User I/O | — | 186 |
| Core Voltage | — | 2.5 V |
| Maximum Frequency | — | 166.67 MHz |
| Programming Interface | — | JTAG (IEEE 1149.1), ByteBlaster |