EP1K50FC256-2N vs EP1K50FC256-3AA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50FC256-2N sa pamamagitan ng Intel at EP1K50FC256-3AA sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K50FC256-2N | EP1K50FC256-3AA |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX 1K Device Family (2.5V) |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | — |
| Embedded Memory (bits) | 40,960 | — |
| Embedded Array Blocks (EABs) | 10 | — |
| Logic Array Blocks (LABs) | 360 | — |
| Maximum User I/O Pins | 186 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| Temperature na Operasyon | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (commercial) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS SRAM |
| Speed Grade | -2 | -3 (faster tier) |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-BGA (FBGA, 17x17 mm) |
| Package Dimensions | 16 x 16 mm | — |
| Configuration Method | JTAG / Passive Serial | SRAM (volatile, requires external config device) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | ACEX-1K |
| Number of Logic Elements | — | 2880 |
| Number of LABs (Logic Array Blocks) | — | 360 |
| Total RAM Bits | — | 40960 |
| Number of I/O Pins | — | 186 |
| Number of Gates | — | 50000 (typical) |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Number of PLLs | — | 4 (per family datasheet) |
| Number of Global Clocks | — | [DATA_NEEDED: number of global clocks] |