EP1K50TI144-1X vs EP1K50TI144-2X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50TI144-1X sa pamamagitan ng Intel at EP1K50TI144-2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K50TI144-1X | EP1K50TI144-2X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | ACEX 1K | ACEX 1K |
| Series | EP1K50 | — |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | — |
| Configurable Logic Blocks (CLBs) | 360 | — |
| Maximum User I/O Pins | 102 | 102 |
| Dedicated Input Pins | 6 | — |
| Number of Terminals | 144 | — |
| Package Code | QFP / TQFP-144 (Industrial) | — |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch | — |
| Terminal Form | Gull Wing | — |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| Maksimum na Taktiko ng Oras | 90 MHz | — |
| Temperature na Operasyon | -40 C to +85 C (Industrial) | — |
| Configuration Method | Volatile SRAM, external configuration device required | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Speed Grade | -1 (slowest, lowest cost) | -2 (mid-tier) |
| Design Toolchain | Quartus II (legacy support) | — |
| Logic Elements | — | 2,880 |
| Typical Gate Count | — | 50,000 gates |
| Configurable Logic Blocks (LABs/CLBs) | — | 360 |
| Embedded SRAM (bits) | — | 40,960 |
| Embedded Array Blocks (EABs) | — | 5 (per datasheet family) |
| Packhaging | — | 144-pin TQFP (TQFP-144), 0.5 mm pitch, gull-wing |
| Temperature Grade | — | Industrial (-40 °C to +100 °C) |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V / 2.5 V / 1.8 V (per bank) |
| Process Technology | — | 0.18 µm CMOS, SRAM-based |
| Maximum Internal Frequency | — | up to 833 MHz (per family) |
| Configuration Mode | — | JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous |
| Supported I/O Standards | — | LVTTL, LVCMOS, PCI |