EP1K50TI144-1X vs EP1K50TI144-3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50TI144-1X sa pamamagitan ng Intel at EP1K50TI144-3N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K50TI144-1X | EP1K50TI144-3N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | ACEX 1K | ACEX 1K (EP1K) |
| Series | EP1K50 | EP1K50 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | — |
| Configurable Logic Blocks (CLBs) | 360 | — |
| Maximum User I/O Pins | 102 | — |
| Dedicated Input Pins | 6 | — |
| Number of Terminals | 144 | — |
| Package Code | QFP / TQFP-144 (Industrial) | — |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch | — |
| Terminal Form | Gull Wing | — |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| Maksimum na Taktiko ng Oras | 90 MHz | — |
| Temperature na Operasyon | -40 C to +85 C (Industrial) | -40 °C to +85 °C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (Pb-free terminal finish, "N" suffix) |
| Speed Grade | -1 (slowest, lowest cost) | -3 (fastest ACEX 1K grade) |
| Design Toolchain | Quartus II (legacy support) | — |
| Logic Elements | — | 2,880 |
| Typical Gates | — | 50,000 |
| Embedded Array Blocks (EABs) | — | 40 (4 Kbit each) |
| Embedded Memory (EAB SRAM) | — | 40,960 bits |
| Maximum User I/O | — | 102 |
| Dedicated Inputs | — | 6 |
| Core Voltage (VCCINT) | — | 2.375 V to 2.625 V (nominal 2.5 V) |
| I/O Bank Voltage (VCCIO) | — | 2.375 V to 5.0 V (multiVolt I/O) |
| Maximum Internal Frequency | — | 166.67 MHz (process node data) |
| Process Technology | — | 0.22 µm CMOS, SRAM-based |
| Packhaging | — | 144-pin TQFP (Industrial, Pb-free) |
| Configuration Interface | — | JTAG (IEEE 1149.1) + passive-serial |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Supply Current (typ/ICC) | — | [DATA_NEEDED: ICC standby] |