EP1S10F780I6N vs EP1S10F484I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1S10F780I6N sa pamamagitan ng Intel at EP1S10F484I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1S10F484I6N - Stratix 10,570 LEs FPGA 484-FBGA | Intel (Altera)
EP1S10F484I6N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1S10F780I6N | EP1S10F484I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix | Stratix |
| Logic Elements | 10,570 | 10,570 |
| Logic Array Blocks (LABs) | 1,057 | 1,057 |
| User I/Os | 426 | — |
| Embedded RAM (Total) | 920,448 bits | — |
| M512 Blocks | 94 (32 x 18 bits each) | — |
| M4K Blocks | 60 (128 x 36 bits each) | — |
| M-RAM Blocks | 1 (4 Kbit) | — |
| PLLs | 6 | — |
| Clock Outputs | 16 | — |
| DSP Blocks | 12 | 48 |
| Transceiver Channels | 12 (not populated on I6 speed grade) | — |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V, 1.8 V, 2.5 V, 3.3 V (per bank) | — |
| Process Technology | 0.13 µm CMOS | 130 nm CMOS |
| Temperature na Operasyon | -40 °C to +100 °C (industrial) | 0C to +85C (Industrial) |
| Speed Grade | -6 (6.0 ns core clock period) | — |
| Packhaging | 780-ball FineLine BGA, 29 x 29 mm, 1.0 mm pitch | 484-ball FBGA (FCBGA), 23 x 23 mm, 1 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Logic Family | CMOS | CMOS |
| Supply Voltage Nominal | 1.5 V | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Bits) | — | 920,448 |
| Maximum User I/O | — | 335 |
| Number of PLLs | — | 6 |
| Peak Reflow Temperature | — | 245 C |
| Configuration Interface | — | JTAG (IEEE 1149.1), Passive Serial, Active Serial |
| Internal Core Speed | — | up to 450 MHz |
| Terminal Finish | — | Tin-Silver-Copper (SnAgCu) |