EP1S30F780I6N vs EP1S40F780I6N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1S30F780I6N sa pamamagitan ng Intel at EP1S40F780I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP1S30F780I6N EP1S40F780I6N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family Stratix —
Logic Elements 32,470 41,250
Total RAM Bits 3,317,184 bits 3,423,744
User I/O Count 597 —
Package Type 780-BBGA, FCBGA (FineLine BGA) —
Temperature na Operasyon -40C to +100C (Industrial, I6) -40C to +100C (industrial)
Process Technology 130 nm —
Supply Voltage (Core) [DATA_NEEDED: core voltage] —
I/O Standards Supported LVTTL, LVCMOS, LVDS, SSTL, HSTL —
Lead-Free / RoHS Lead-free terminal finish (N suffix), RoHS-compliant —
Speed Grade -6 —
DSP Blocks Yes (TriMatrix + DSP blocks per Stratix family) 12
Uri ng Pagpapasok Surface Mount Surface Mount
Level ng MSL 3 (per typical FBGA moisture sensitivity) 3
JEDEC Code (e1) e1 (Pb-free / matte tin) —
Series — Stratix
Logic Array Blocks (LABs) — 4,125
User I/O Pins — 615
Core Voltage (VCCINT) — 1.425 V to 1.575 V
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
PLLs — [DATA_NEEDED: PLL count per Stratix handbook]
Embedded Multipliers — Yes (per DSP block)
Configuration Method — SRAM-based, volatile
Packhaging — 780-FBGA (29 x 29 mm, 1.0 mm pitch)
Lead Free — Yes
Process Node — 150 nm CMOS
Tindminan RoHS — Compliant

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